Show simple item record

dc.contributor.authorMaiti, C.K.
dc.contributor.authorMaiti, T.K.
dc.date.accessioned2020-03-17 03:00:34
dc.date.accessioned2020-04-01T06:50:48Z
dc.date.available2020-04-01T06:50:48Z
dc.date.issued2012-11-28
dc.identifier1007743
dc.identifier.urihttp://library.oapen.org/handle/20.500.12657/22437
dc.description.abstractThis book brings together new developments in the area of strain-engineered MOSFETs using high-mibility substrates such as SIGe, strained-Si, germanium-on-insulator and III-V semiconductors into a single text which will cover the materials aspects, principles, and design of advanced devices, their fabrication and applications. The book presents a full TCAD methodology for strain-engineering in Si CMOS technology involving data flow from process simulation to systematic process variability simulation and generation of SPICE process compact models for manufacturing for yield optimization.
dc.languageEnglish
dc.subject.classificationthema EDItEUR::T Technology, Engineering, Agriculture, Industrial processes::TJ Electronics and communications engineering::TJF Electronics engineeringen_US
dc.subject.otherEngineering
dc.subject.otherElectrical Engineering
dc.titleStrain-Engineered MOSFETs
dc.typebook
oapen.identifier.doi10.1201/9781315216577
oapen.relation.isPublishedBy63ecf019-b273-4b96-9b26-19d50005fba4
oapen.relation.isFundedByb818ba9d-2dd9-4fd7-a364-7f305aef7ee9
oapen.relation.isbn9781466503472
oapen.relation.isbn9781138075603
oapen.relation.isbn9781466500556
oapen.relation.isbn9781315216577
oapen.collectionKnowledge Unlatched (KU)
oapen.grant.number102701
oapen.grant.programKU Select 2018: STEM Backlist Books
oapen.identifier.isbn9781138075603
grantor.number102701


Files in this item

Thumbnail

This item appears in the following Collection(s)

Show simple item record