Nanoparticle Engineering for Chemical-Mechanical Planarization
Fabrication of Next-Generation Nanodevices
Author(s)
Paik, Ungyu
Park, Jea-Gun
Collection
Knowledge Unlatched (KU)Number
102698Language
EnglishAbstract
Increasing reliance on electronic devices demands products with high performance and efficiency. Such devices can be realized through the advent of nanoparticle technology. This book explains the physicochemical properties of nanoparticles according to each step in the chemical mechanical planarization (CMP) process, including dielectric CMP, shallow trend isolation CMP, metal CMP, poly isolation CMP, and noble metal CMP. The authors provide a detailed guide to nanoparticle engineering of novel CMP slurry for next-generation nanoscale devices below the 60nm design rule. This comprehensive text also presents design techniques using polymeric additives to improve CMP performance.
Keywords
Material SciencesDOI
10.1201/9780429291890ISBN
9781000023220, 9780367446062, 9781420059113, 9780429291890, 9781420059137OCN
1100491609Publisher
Taylor & FrancisPublisher website
https://taylorandfrancis.com/Publication date and place
2009Imprint
CRC PressClassification
Nanotechnology