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dc.contributor.authorXu, Yilin
dc.date.accessioned2023-05-02T14:39:21Z
dc.date.available2023-05-02T14:39:21Z
dc.date.issued2023
dc.identifier.urihttps://library.oapen.org/handle/20.500.12657/62898
dc.description.abstractPhotonic integrated circuits (PIC) become increasingly important for numerous applications. Mass production of PIC has become widely available, but large-volume low-cost photonic packaging still represents a challenge. Additive micro-fabrication of free-form optical coupling structures is discussed as a concept to overcome this technology gap. Multi-photon 3D-lithography is used to fabricate dielectric waveguides ("photonic wire bonds", PWB) as well as facet-attached microlenses (FaML).en_US
dc.languageEnglishen_US
dc.relation.ispartofseriesKarlsruhe Series in Photonics & Communicationsen_US
dc.subject.classificationthema EDItEUR::T Technology, Engineering, Agriculture, Industrial processes::TH Energy technology and engineering::THR Electrical engineeringen_US
dc.subject.otherPhotonische Aufbau- und Verbindungstechnik; integrierte photonische Schaltkreise; Multiphotonenlithographie; additive 3D Mikrofabrikation; Mikrooptik; photonic packaging; photonic integrated circuits (PIC); multi-photon lithographie; additive 3D micro-fabrication; micro-opticsen_US
dc.titleHybrid photonic assemblies based on 3D-printed coupling structuresen_US
dc.typebook
oapen.identifier.doi10.5445/KSP/1000154744en_US
oapen.relation.isPublishedBy44e29711-8d53-496b-85cc-3d10c9469be9en_US
oapen.series.number28en_US
oapen.pages292en_US
peerreview.anonymityAll identities known
peerreview.id51a542ec-eaeb-47c2-861d-6022e981a97a
peerreview.open.reviewNo
peerreview.publish.responsibilityBooks or series editor
peerreview.review.stagePre-publication
peerreview.review.typeFull text
peerreview.reviewer.typeEditorial board member
peerreview.reviewer.typeExternal peer reviewer
peerreview.titleDissertations in Series (Dissertationen in Schriftenreihe)


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