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dc.contributor.editorDebaillie, Björn
dc.contributor.editorFerrari, Philippe
dc.contributor.editorBelot, Didier
dc.contributor.editorBrunier, François
dc.contributor.editorGaquiere, Christophe
dc.contributor.editorBusson, Pierre
dc.contributor.editorSteikūnienė, Urtė
dc.date.accessioned2024-11-14T10:41:19Z
dc.date.available2024-11-14T10:41:19Z
dc.date.issued2024
dc.identifier.urihttps://library.oapen.org/handle/20.500.12657/94682
dc.description.abstractThis book presents the latest research roadmaps and achievements from the European ecosystem (industry, research, and academia) driving the development of future wireless, wired, optical and satcom applications utilising the mm-wave and sub-THz bands. It covers the entire value chain, including technologies, devices, characterisation, architectures, circuits, 3D heterogeneous integration and packaging. As the interconnectedness of our world continues to expand, the importance of global innovation in communication systems and technologies grows significantly. The increasing reliance on digital communication necessitates systems that can manage higher data traffic, provide faster and more reliable connectivity, and sustainably support a diverse range of applications. Achieving these goals requires a shift towards higher frequency bands (mm-wave and sub-THz) and the adoption of disruptive technologies. Heterogeneous integration of (Bi)CMOS, SOI, and III/V components such as GaN or InP, along with advanced packaging techniques, is essential to realise ubiquitous, ultra-high bandwidth, and low latency networks. To ensure that future communication systems are not only technologically advanced but also sustainable and responsible, it is crucial to minimize their environmental impact by considering the materials used, manufacturing processes, operational efficiency, and recyclability. The book captures the synergetic interactions between European Chips JU projects SHIFT and Move2THz, the European 3D heterogenous integration and packaging community and the MTT-TC9 society. These interactions were forged during the International Workshop on ""Key Enabling Technologies for Future Wireless, Wired, Optical and Satcom Applications"" at the European Microwave Week in Paris, France, on 22 September, 2024. Whether you are a professional in the field or simply interested in the future of communication technologies, this book offers invaluable insights into the technological breakthroughs shaping our digital future. The Open Access version of this book, available at http://www.taylorfrancis.com, has been made available under a Creative Commons Attribution-Non Commercial (CC-BY-NC) 4.0 license.en_US
dc.languageEnglishen_US
dc.relation.ispartofseriesRiver Publishers Series in Communications and Networkingen_US
dc.subject.classificationthema EDItEUR::T Technology, Engineering, Agriculture, Industrial processes::TJ Electronics and communications engineering::TJK Communications engineering / telecommunicationsen_US
dc.subject.classificationthema EDItEUR::T Technology, Engineering, Agriculture, Industrial processes::TJ Electronics and communications engineering::TJF Electronics engineering::TJFC Electronics: circuits and componentsen_US
dc.subject.classificationthema EDItEUR::T Technology, Engineering, Agriculture, Industrial processes::TH Energy technology and engineering::THR Electrical engineeringen_US
dc.subject.otherTelecommunications;Circuits;Devicesen_US
dc.titleKey enabling technologies for future wireless, wired, optical and satcom applicationsen_US
dc.typebook
oapen.identifier.doi10.1201/9781003587309en_US
oapen.relation.isPublishedBy7b3c7b10-5b1e-40b3-860e-c6dd5197f0bben_US
oapen.relation.isFundedBy3983007a-5726-4f1e-b9df-3fbc771f2916en_US
oapen.relation.isbn9781040300169en_US
oapen.relation.isbn9788770046657en_US
oapen.relation.isbn9788770046664en_US
oapen.imprintRiver Publishersen_US
oapen.pages222en_US
oapen.grant.number101096256SHIFTHORIZONKDTJU20211IA
oapen.grant.programSHIFT


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