Materials Interaction and Reliability
Lo, Randy Hsiao-Yu
In semiconductor manufacturing, understanding how various materials behave and interact is critical to making a reliable and robust semiconductor package. Semiconductor Packaging: Materials Interaction and Reliability provides a fundamental understanding of the underlying physical properties of the materials used in a semiconductor package. By tying together the disparate elements essential to a semiconductor package, the authors show how all the parts fit and work together to provide durable protection for the integrated circuit chip within as well as a means for the chip to communicate with the outside world. The text also covers packaging materials for MEMS, solar technology, and LEDs and explores future trends in semiconductor packages.
KeywordsCircuits and Devices; Electromagnetics and Microwaves; Electronic Packaging; ENG; MATERIALS; ElectricalEngineering; SCI-TECH; STM; array; ball; compound; frame; grid; lead; level; molding; package; wafer
PublisherTaylor & Francis
Publication date and place2012
Circuits & components