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    Semiconductor Packaging

    Proposal review

    Materials Interaction and Reliability

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    Author(s)
    Chen, Andrea
    Lo, Randy Hsiao-Yu
    Language
    English
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    Abstract
    In semiconductor manufacturing, understanding how various materials behave and interact is critical to making a reliable and robust semiconductor package. Semiconductor Packaging: Materials Interaction and Reliability provides a fundamental understanding of the underlying physical properties of the materials used in a semiconductor package. By tying together the disparate elements essential to a semiconductor package, the authors show how all the parts fit and work together to provide durable protection for the integrated circuit chip within as well as a means for the chip to communicate with the outside world. The text also covers packaging materials for MEMS, solar technology, and LEDs and explores future trends in semiconductor packages.
    URI
    https://library.oapen.org/handle/20.500.12657/41662
    Keywords
    Circuits and Devices; Electromagnetics and Microwaves; Electronic Packaging; ENG; MATERIALS; ElectricalEngineering; SCI-TECH; STM; array; ball; compound; frame; grid; lead; level; molding; package; wafer
    DOI
    10.1201/b11260
    Publisher
    Taylor & Francis
    Publisher website
    https://taylorandfrancis.com/
    Publication date and place
    2012
    Imprint
    CRC Press
    Classification
    Electronics engineering
    Electronics: circuits and components
    Materials science
    Pages
    216
    Rights
    http://creativecommons.org/licenses/by-nc-nd/4.0
    • Imported or submitted locally

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    License

    • If not noted otherwise all contents are available under Attribution 4.0 International (CC BY 4.0)

    Credits

    • logo EU
    • This project received funding from the European Union's Horizon 2020 research and innovation programme under grant agreement No 683680, 810640, 871069 and 964352.

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